Plum Five Co. Limited


300mm probing solution of diced wafer on the film frame;
For WLCSP and strip form devices such as BGA-QFN etc.; and
Multi-probing method with the highest throughpu result.

300mm diameter probing area;
X & Y linear motor technology;
Precision & compensation probing
Possible for less that 1mm square chip (device)
Multi-area alignment function; and
Small Space: W1550mm x D1000mm

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